| 111 | ,34, pp1733–1746,(SCI) |
| 111 | ,34, pp1665–1673,(SCI) |
| 111 | ,34, pp1675–1684,(SCI) |
| 111 | ,34, pp1685–1696,(SCI) |
| 111 | ,34, pp2577–2589,(SCI) |
| 110 | ,33, pp2607–2618,(SCI) |
| 110 | ,33, pp2577–2589,(SCI) |
| 109 | ,10,(SCI) |
| 108 | ,12,(SCI) |
| 108 | ,31, pp531-542,(SCI) |
| 108 | ,10,(SCI) |
| 107 | ,8,(SCI) |
| 107 | ,8,(SCI) |
| 107 | ,1, pp1-12,(SCI) |
| 107 | ,8,(SCI) |
| 107 | ,8,(SCI) |
| 107 | ,10, pp1-11,(SCI) |
| 107 | ,24, pp4247-4266,(SCI) |
| 106 | ,7,(SCI) |
| 106 | ,8, pp1243-1252,(EI) |
| 105 | Kun-Neng Chen, Chao-Ming Hsu, Jing Liu, Yi-Tang Chiu and Cheng-Fu Yang,Effect of Different Heating Process on the Photoluminescence Properties of Perovskite Eu-Doped BaZrO3 Powder,Applied Sciences,6, pp1-12,(SCI) |
| 105 | Jao-Hwa Kuang, Chao-Ming Hsu, Ah-Der Lin,Determination of piezoelectric parameters from the measured natural frequencies of a piezoelectric circular plate, Integrated Ferroelectrics,168, pp36-52,(SCI) |
| 105 | Fang-Hsing Wang, Kun-Neng Chen, Chao-Ming Hsu, Min-Chu Liu and Cheng-Fu Yang,Investigation of the Structural, Electrical, and Optical Properties of the Nano-Scale GZO Thin Films on Glass and Flexible Polyimide Substrates,Nanomaterials,6, pp1-13,(SCI) |
| 105 | Jao-Hwa Kuang, Chao-Ming Hsu, Ah-Der Lin,The Coffin-Manson Formula for Unleaded Sn/3.0Ag/0.5Cu Solder,Integrated Ferroelectrics,172, pp200-214,(SCI) |
| 105 | ,7, pp1-12,(SCI) |
| 105 | , pp371-375,(AHCI) |
| 105 | ,7, pp1917-1923,(EI) |
| 104 | Jao-Hwa Kuang, Chao-Ming Hsu, Ah-Der Lin,A Study on the Conductivity Variation of Au-Coated Conductive Particles in ACF Packaging Process,Journal of Nanomaterials,2015, pp1-8,(SCI) |
| 104 | Chao-Ming Hsu, Wen-Cheng Tzou, Cheng-Fu Yang,Investigation of the High Mobility IGZO Thin Films by Using Co-Sputtering Method,Materials,8, pp2769-2781,(SCI) |
| 104 | ,06, pp3291-3297,(EI) |
| 103 | ,293, pp195-204,(EI) |
| 103 | ,293, pp111-120,(EI) |
| 103 | ,293, pp101-110,(EI) |
| 103 | ,293, pp81-90,(EI) |
| 102 | ,The Effect of Nano-Scale Local Defects on Mechanical Properties of Silicon and Diamond Films,Journal of Integrated Ferroelectric,143, pp1~9,(SCI,SSCI) |
| 102 | Chun-Ho Yin, Chao-Ming Hsu, Ping-Shen Su, and Jao-Hwa Kuang,Simulation and Analysis on the Blind Hole Method Using the Finite Element Method,Applied Mechanics and Materials,328, pp990~994,(SSCI) |
| 102 | Chun-Ho Yin, Chao-Ming Hsu and Jao-Hwa Kuang,The Temperature and Residual Stress Distributions of Butt Weld Pass on Nickel Alloy 690 Plate,Advanced Materials Research,690-693, pp2651~2654,(SSCI) |
| 102 | Chao-Ming Hsu, Ah-Der Lin, Hui-Lung Chien,
Tsung-Pin Hung, Jao-Hwa Kuang,Using Nano Indentation Techniques to Investigate the Young’s Moduli for Human Teeth of Different Ages,Journal of Bionanoscience,7, pp154~158,(SCI,SSCI) |
| 102 | Chao-Ming Hsu, Ah-Der Lin, Tsung-Pin Hung, Wen-Chun Chiu and Jao-Hwa Kuang,Shear Toughness Evaluation of Solder Joints for the Reliability Tests,Applied Mechanics and Materials,311, pp467~471,(SSCI) |
| 102 | Shih-Chieh Sun, Chi-Wei Chung, Chao-Ming Hsu, Jao-Hwa Kuang,The Squeeze Film Damping Effect on Dynamic Responses of Micro-electromechanical Resonators,Applied Mechanics and Materials,284-287, pp1961~1965,(SSCI) |
| 102 | Shih-Chieh Sun, Chao-Ming Hsu, Jau-Wen Lin and Jao-Hwa Kuang,The Local Defect Effect on Molecular Local Density State in Carbon Diamond Structures,Applied Mechanics and Materials,275-277, pp1810~1813,(SSCI) |
| 102 | ,Residual Stress and Bead Profile Analysis of Pulsed Nd: YAG Laser Lap Welding,Advanced Material Research,284-287, pp915~918,(SSCI) |
| 102 | ,The Effect of Plaque and Artery Parameters on Stent Expansion during the Implantation Process,Life Science,10, pp1717~1720,(SCI,SSCI) |
| 102 | ,The Growth of Mouse Osteoblast Cell under Vibration Wave in Vitro,Life Science,10, pp1721~1726,(SCI,SSCI) |
| 102 | ,2013, pp1-10,(SCI) |
| 101 | Shih-Chieh Sun, Chi-Wei Chung, Chao-Ming Hsu and Jao-Hwa Kuang,The Squeeze Film Effect on Micro-electromechanical Resonators,Journal of Vibroengineering,14, pp1486~1493,(SCI,SSCI) |
| 101 | Ah-Der Lin, Chao-Ming Hsu, Chich-Kuan Chen, Da-Yun Huang, Tsung-Pin Hung, and Jao-Hwa Kuang∗,Stainless Steel Surface Etching Morphologies Using Electro Plasma Technology,Advanced Science Letters,13, pp178~182,(SSCI) |
| 101 | Chao-Ming Hsu, Tsung-Pin Hung, Ah-Der Lin , and Jao-Hwa Kuang,An Investigation on the Shear Toughness for Sn/3.0Ag/0.5Cu and Sn/37Pb Solder Ball Joints,Advanced Material Research,476-478, pp2455~2458,(SSCI) |
| 101 | Jao-Hwa Kuang, Tsung-Pin Hung, Kuen Lai,
Chao-Ming Hsu, Ah-Der Lin,The Surface Absorption Coefficient of S304L Stainless Steel by Nd: YAG Micro-Pulse Laser,Advanced Material Research,472-475, pp2531~2534,(SSCI) |
| 101 | Jao-Hwa Kuang, Tsung-Pin Hung, Shian-Huan Chiou,
Chao-Ming Hsu,Enhancement of coupling efficiency of butterfly package laser modules based on Post-Weld-Shift compensation,Applied Mechanics and Materials,145, pp109~113,(SSCI) |
| 100 | S. C SUN, C. Y. HUANG, CHAO MING HSU,AND JAO HAW KUANG*,The Effect of Residual Stress on Coupling Power Loss of VCSEL Modulus,American Journal of Engineering and Technology Research,11, pp618~621,(SSCI) |
| 99 | Jao-Hwa Kuang* Chao-Ming Hsu, Chin-Che Hu,Dynamic Behavior of Globoidal Cam Systems with Torque Compensation Mechanisms,Mechanism and Machine Theory,45, pp1201~1214,(SCI,SSCI) |
| 94 | Jao-Hwa Kuang and Chao-Ming Hsu,The Residual Stress and Post-Weld-Shift Distributions in VCSEL Packaging,Engineering Science & Technology Bulletin NSC,81, pp168~171 |
| 92 | C.S. HSIEH, J.M. CHEN, J.M. HSU, M.T. SHEEN, J.H. KUANG,and W.H. CHENG,Effect of Temperature Cycling on Angular Alignment on Angular Alignment in Add/Drop Filter Module Packaging,J. of Electronic Materials,32, pp137~141,(SCI,SSCI) |
| ,33, pp2607–2618,(SCI) |
| ,33, pp2577–2589,(SCI) |
| ,34, pp1665–1673,(SCI) |
| ,34, pp1675–1684,(SCI) |
| ,34, pp1685–1696,(SCI) |
| ,34, pp1733–1746,(SCI) |
| ,(SCI) |
