101
(SSCI)
Q.C. Hsu, Y.Y. Cheng and B.H. Liu, 2012 (January), “Study on Bonding Properties of Copper and Aluminum in Nano Scale Using Molecular Dynamics Simulation,” Advanced Materials Research, Vols. 452-453 (2012) pp 1429-1433. (EI), ISSN: 1662-8985. (NSC 99-2221-E-151-012-)
