100
Quang-Cherng Hsu, Yen-Yu Cheng and Bao-Hsin Liu, “Study on Bonding Properties of Copper and Aluminum in Nano Scale Using Molecular Dynamics Simulation,” 2011 International Conference on Mechanical Science and Engineering, Chengchou, China, 2011.12.8 -10, Paper ID 3191. (NSC 99-2221-E-151 -012 -) 後續轉刊在國際期刊Advanced Materials Research, Vols. 452-453 (2012) pp 1429-1433. (EI), ISSN: 1022-6680.
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