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Q. C. Hsu, C. D. Wu, and T. H. Fang, 2004, “Studies on Deformation Mechanism and Die Cone Effects on Nanoimprint Processes by Molecular Dynamics,” The 8th International Conference on Numerical Methods in Industrial Forming Processes, Columbus, Ohio, USA, pp. 1577-1582, 2004/6/13~17. (NSC 92-2212-E-151-013-)後續刊載Source: MATERIALS PROCESSING AND DESIGN: MODELING, SIMULATION AND APPLICATIONS, PTS 1 AND 2 Book Series: AIP CONFERENCE PROCEEDINGS Volume: 712 Pages: 1577-1582 Published: 2004, ISBN: 0-7354-0188-8 (SCIE)
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